Custom pricing system and method

ABSTRACT

The invention provides a computerized system and method for calculating a custom die price. Specifically, the invention provides an interface for designating base parameters and custom parameters. A reference die is synthetically created based on a design methodology and the base parameters. Based on the reference die and the custom parameters, a complexity factor is calculated. The custom die price can then be calculated based on the base parameters, custom parameters and the complexity factor.

BACKGROUND OF THE INVENTION

[0001] 1. Technical Field

[0002] The present invention relates to a custom pricing system andmethod. Specifically, the invention calculates a custom die price basedon designated parameters and a calculated complexity factor. Theinvention can further calculate a chip price based on the custom dieprice and other factors, such as packaging and quantity.

[0003] 2. Background Art

[0004] In the production of electronic devices, chips are oftenrequired. In general, a chip can be defined by a die and a package. Thedie includes the parameters required to build a functional chip, whilethe package includes parameters defining how the chip interacts with itsenvironment. While many types of standard dies and packaging can beoffered by a chip manufacturer, customers frequently need a custom chipand/or packaging for certain applications. As a result, manufacturersfrequently provide customers with the ability to order a chip that hasone or more parameters that differ from their standard chips.

[0005] For many applications, several configurations of dies andpackages can solve a particular challenge or situation. In determiningthe appropriate die and/or package configuration, customers generallyseek to minimize the cost of obtaining the die and/or package.Therefore, a customer may make several price inquiries with differentdie configurations and/or different packaging options to themanufacturer. Frequently, the customer will seek to quickly resolve thisprocess so that manufacturing and further design can move forward.

[0006] From a manufacturer's perspective, accurate pricing is criticalin being able to profitably manufacture custom chips. To do this, themanufacturer must accurately anticipate the costs of manufacturing thechips and factor in a desired profit to arrive at a final price. Amanufacturer that over-estimates costs can lose business to othermanufacturers. Conversely, a manufacturer that under-estimates costs maylose their profit for a particular custom job. Additionally, themanufacturer generally seeks to minimize the time required for acustomer to place an order while simultaneously minimizing the burden onits own operations. This allows for faster orders at less cost, and moresatisfied customers. Consequently, accurate and timely pricing fordifferent custom dies with or without custom packaging is important fromboth the customer and manufacturer perspectives.

[0007] Currently, the process used to obtain the desired pricing isinefficient and confusing for the customer. For example, a manufacturermay provide a customer with a spreadsheet price guide. The price guidemay contain entries for various solutions, including custom die optionswith packaging options. The customer can then look up a solution anddetermine its cost. However, if the customer desires to slightly modifya solution, he/she is frequently required to obtain a custom quote fromthe manufacturer. The customer may make many inquiries for custom quotesbefore determining a satisfactory price/performance trade off for thesolution. Because of the lack of customer knowledge, the quote may beunsatisfactory and cause frustration for the customer. As a result, thecustomer may waste design resources, become dissatisfied with themanufacturer and/or seek other vendors. The process can furtherfrustrate the customer when a desired packaging option has not beendetermined, but a quotation for a custom die is desired. From themanufacturer's perspective, an engineer is frequently required toanalyze the custom solutions provided by the customer and generate thecustom quotations. This process can be time consuming and alsoinefficiently uses the employee's skills.

SUMMARY OF THE INVENTION

[0008] Therefore, there exists the need for a customer to quickly andeasily obtain price quotations for custom dies with varying parameters.There exists a further need to incorporate the custom die price into apricing system that provides a custom chip price by accounting for otherfactors, including volume and packaging. A further need exists for sucha system to be computer/web based for easy and efficient access.

[0009] The current invention provides a computer based custom diepricing method and system. Under the invention, various die parametersare designated and a reference die is created. The reference die is usedto calculate a complexity factor, which is used to calculate the customdie price. Using the invention, a customer can quickly and easilydetermine a custom die that is most appropriate for his/her particularchallenge or situation. The invention can further provide customquotations for a custom chip based on the custom die.

[0010] A first aspect of the invention provides a computerized method ofcalculating a custom die price, comprising: providing an interface fordesignating base parameters; selecting a base die based on the baseparameters; creating a reference die based on a design methodology andthe base parameters; calculating a complexity factor based on designatedcustom parameters and the reference die; and calculating the custom dieprice based on the base die, the custom parameters and the complexityfactor.

[0011] A second aspect of the invention provides a computerized methodof calculating a custom die price, comprising: designating baseparameters; calculating a base die price based on the base parameters;creating a reference die based on a design methodology and the baseparameters; creating a custom die by designating custom parameters;calculating a complexity factor based on the custom die and thereference die; and calculating the custom die price based on the basedie price, the custom die and the complexity factor.

[0012] A third aspect of the invention provides a system for determininga custom die price, comprising: a base die system for designating baseparameters; a reference die system for creating a reference die based onthe base parameters and a design methodology; a custom die system fordesignating custom parameters; a complexity system for calculating acomplexity factor based on the custom parameters and the reference die;and a calculation system for calculating the custom die price based onthe base parameters, the custom parameters and the complexity factor.

[0013] A fourth aspect of the invention provides a computer programproduct comprising a computer useable medium having computer readableprogram code embodied therein for determining a custom die price, theprogram product comprising: program code for designating baseparameters; program code for calculating a base die price based on thebase parameters; program code for creating a reference die based on adesign methodology and the base parameters; program code for creating acustom die by designating custom parameters; program code forcalculating a complexity factor based on the custom die and thereference die; and program code for calculating a custom die price basedon the base die price, the custom die and the complexity factor.

[0014] The exemplary aspects of the present invention are designed tosolve the problems herein described and other problems not discussed,which are discoverable by a skilled artisan.

BRIEF DESCRIPTION OF THE DRAWINGS

[0015] These and other features and advantages of this invention will bemore readily understood from the following detailed description of thevarious aspects of the invention taken in conjunction with theaccompanying drawings in which:

[0016]FIG. 1 depicts a die pricing system according to one aspect of theinvention;

[0017]FIG. 2 depicts a chip pricing system according to one aspect ofthe invention;

[0018]FIG. 3 depicts a user interface according to one aspect of theinvention; and

[0019]FIG. 4 depicts a chip pricing method according to one aspect ofthe invention.

[0020] It is noted that the drawings of the invention are not to scale.The drawings are intended to depict only typical aspects of theinvention, and therefore should not be considered as limiting the scopeof the invention. In the drawings, like numbering represents likeelements between the drawings.

DETAILED DESCRIPTION OF THE INVENTION

[0021] Generally stated, the present invention calculates a custom dieprice based on designated parameters and a complexity factor. Thecomplexity factor is calculated based on a reference die, created from aportion of the designated parameters.

[0022] Turning to FIG. 1, a die pricing system according to one aspectof the invention is depicted. Custom pricing system 10 generallycomprises computer 12 and die pricing system 28. User 26 can interactwith computer 12 and die pricing system 28 to obtain a custom die price.

[0023] Computer 12 generally comprises memory 14, central processingunit (CPU) 16, input/output (I/O) interfaces 18 and bus 20. A database24 may also be provided for storage of data relative to processingtasks. Memory 14 (and database 24) may comprise any known type of datastorage and/or transmission media, including magnetic media, opticalmedia, random access memory (RAM), read-only memory (ROM), a data cache,a data object, etc. Moreover, memory 14 (and database 24) may reside ata single physical location, comprising one or more types of datastorage, or be distributed across a plurality of physical systems invarious forms. CPU 16 may comprise a single processing unit, or bedistributed across one or more processing units in one or morelocations, e.g., on a client and server. A server computer typicallycomprises an advanced mid-range multiprocessor-based server, such as theRS6000 from IBM, utilizing standard operating system software, which isdesigned to drive the operation of the particular hardware and which iscompatible with other system components and I/O controllers. I/Ointerfaces 18 may comprise any system for exchanging information withone or more external devices 22. For example, external devices 22 maycomprise any known type of input/output device including an I/O port(serial or parallel), an universal serial bus (USB) controller, anetwork system, modem, keyboard, mouse, scanner, voice recognitionsystem, monitor (cathode-ray tube (CRT), liquid-crystal display (LCD),etc.), printer, disc drives, etc. Bus 20 provides a communication linkbetween each of the components in computer 12 and likewise may compriseany known type of transmission link, including electrical, optical,wireless, etc. In addition, although not shown, additional components,such as cache memory, communication systems, system software, etc., maybe incorporated into computer 12.

[0024] Die pricing system 28 is shown stored in memory 14. Die pricingsystem 28 generally includes base die system 30, reference die system32, custom die system 34, complexity system 36 and calculation system38. User 26 can interact with die pricing system 28 to obtain a customprice for a die. User 26 may interact with die pricing system 28 byinteracting directly with external devices 22, and/or by interactingwith another computing device 27 in communication with computer 12 in aclient-server environment. For example, device 27 could communicate withcomputer 12 through a direct connection, a private network, a virtualprivate network (VPN), local area network (LAN) or wide area network(WAN). For example, die pricing system 28 can execute on a computer 12connected to the world wide web. User 26 can subsequently access theworld wide web using another device and interact with die pricing system28.

[0025] Base die system 30 includes an interface for user 26 to designatebase parameters and/or select a base die. The base parameters designatedby user 26 can include, for example, a technology (e.g., theComplimentary Metal-Oxide Semiconductor (CMOS) type used, copper,silicon, etc.), the die size as defined by an X-dimension and aY-dimension, and the number of levels of metal.

[0026] In one embodiment, one or more base parameters are designated(e.g., through drop down menus or the like). A set of possible base diesis then provided from database 24, wherein each possible base dieincludes the first base parameter designated. For example, if a desirednumber of levels of metal is designated, all dies that have thespecified levels of metal can be provided as possible base dies. User 26can then select one base die from the set of possible base dies. Inanother embodiment, one base die is “suggested” to user 26 based on thedesignated parameters. In either event, calculation system 38 can thenreference database 24 to determine a base die price.

[0027] Once base die parameters have been designated, user 26 can usecustom die system 34 to designate custom parameters. Based on thedesignated custom parameters (and the base parameters), a custom die iscreated. Custom parameters can include, for example, any cores (3rdparty circuitry placed onto a die that performs specific functions, suchas networking, timers, microprocessing, etc.), oxide levels (to preventcross-talk), a solder type (alpha level), a cell logic circuit count,register array parameters and memory parameters. The register arrayparameters can include the amount, whether it is a parallel or serieslayout, etc. Various memory parameters can include the type and amountof embedded dynamic RAM (DRAM), the type and density of static RAM(SRAM), the definition of memory macros, etc.

[0028] Reference die system 32 synthetically creates a reference diebased on the base parameters (or base die) and a specific designmethodology. Specifically, the reference die has the designated baseparameters and predetermined custom parameters that are set based on aparticular design methodology. Typically, the reference die is the mostcomplex die that can be created based on the designated base parametersand provides a baseline for comparison with the custom die. Insynthetically creating the reference die, any design methodology can beused, and any die configuration can be targeted. For example, thereference die can be created based on the IBM Application SpecificIntegrated Circuit (ASIC) design methodology. Moreover, a most complexdie can be defined as the most densely packed die that a manufacturercan produce given various constraints inherent to the base parametersand manufacturing process. Using the ASIC design methodology, thereference chip can be defined as fully populated with 50% logic and 50%SRAM/DRAM. Factors incorporated include die edge, cell size,wireability, enhanced DRAM (eDRAM) macro size and design rules, etc.

[0029] Once the reference die is created, complexity system 36calculates a complexity factor based on the designated customparameters, or custom die, and the reference die. The complexity factorprovides a measure of relative complexity between the designated customparameters (custom die) and the reference die. For example, thecomplexity factor can be calculated by determining a custom die yieldbased on the custom parameters (custom die) and a reference die yieldbased on the reference die. The custom die yield can then be divided bythe reference die yield to provide the complexity factor. In addition tothe relative yields, other factors, such as manufacturing location, timeschedule, and process type (i.e., 200 mm vs. 300 mm), can beincorporated into the complexity factor.

[0030] Various methods can be used to determine the two yields. Forexample, a yield can be calculated as the wafer final test (WFT) orfunctional yield. The WFT yield is the percent of dies that meet allfinal parametric functional electrical test specifications, or thepercent of fault-free dies. This yield can be based, at least in part,on die area. A more precise yield may be achieved by consideringadditional factors including circuit count, circuit type and circuitlayout.

[0031] The two main components of a WFT yield are systematic (gross)defects and random defects. Various methods for predicting these defectsare well known in the art. One such method uses a critical area(dependent upon the physical layout of the die) and a defect density inthe fabricator (a value independent of the die) to calculate the WFTyield. Critical area is the area on the die in which the center of adefect must be located to cause a fault. The defect density can bedetermined by tracking the performance of the fabricator.

[0032] Once the complexity factor has been determined, calculationsystem 38 calculates the custom die price based on the base parameters(base die), the custom parameters (custom die) and the complexityfactor. Specifically, an initial custom die price can be provided bymodifying the base die price (calculated as described above) based onthe custom parameters. For example, certain custom parameters canincrease the custom die price relative to the base die price while othercustom parameters may decrease the custom die price relative to the basedie price. Once calculated, the initial custom die price can then beadjusted using the complexity factor. In one embodiment, the initialcustom die price is multiplied by the complexity factor to yield thecustom die price. Other methods of adjusting the custom die price can beused and are equally covered by the invention.

[0033] It should be understood that custom pricing system 10 can includedie pricing system 28 as well as other systems. For example, FIG. 2depicts a custom pricing system 110 according to another aspect of theinvention in which a chip price is calculated based, in part, on thecustom die price. Custom pricing system 110 generally comprises computer12 and chip pricing system 40. User 26 can interact with computer 12 andchip pricing system 40 to obtain a custom price in a substantiallysimilar manner as previously discussed regarding die pricing system 28.

[0034] As indicated above, a chip is the combination of a die and apackage. Thus, the chip price will include the custom die price. Chippricing system 40 is shown stored in memory 14 and includes die pricingsystem 28, packaging system 42 and volume system 44. The discussion withreference computer 12 and its components and die pricing system 28 inFIG. 1 applies equally to FIG. 2.

[0035] Packaging system 42 calculates a chip price based on the customdie price and designated packaging parameters. Packaging parameters caninclude a package material (ceramic, silicon, plastic, etc.), a packagesize (including carrier size, chip size), a number of I/O pins/leads,layout, and pin configuration. An interface of packaging system 42 canlimit the designation of packaging parameters to ensure that only validpackaging parameters and combinations of parameters are designated. Thechip price can be adjusted upward or downward depending on the packagingparameters selected.

[0036] Volume system 44 can adjust a price based on a designatedquantity. For example, volume system 44 can provide an interface fordesignating a chip quantity. Based on the chip quantity, volume system44 can adjust the chip price upward or downward. Alternatively, volumesystem 44 can adjust the die price and/or package price independently.

[0037]FIG. 3 depicts user interface(s) for carrying out the presentinvention according to one embodiment of the invention. In this case, aweb based interface 50 allows user 26 to select base parameters 52. Baseparameters 52 are indicated by an asterisk (*) next to the identifier.Interface 50 limits the options for base parameters 52 by using a dropdown list 54 to ensure that only valid base parameters are designated.Once selected, a base price 56 can be generated and displayed based onan assumed quantity (e.g., 50,000 Units). Interface 50 further allowscustom parameters (device adders) to be defined in device adders area 58after base parameters 52 have been defined. This allows interface 50 toonly present those options available for the particular base parameters52 selected. Once further custom parameters are selected, custom dieprice 59 can be displayed.

[0038] At any time, a user can select packaging parameters 60 in packageinput area 62. Based on selections for packaging parameters 60, otherparameters may be presented in package adders area 64. A separatepackage price 66 can be displayed based on packaging parameters 60. Achip price 68 is displayed in module price area 70 based on packageprice 66 and custom die price 53.

[0039] It is understood that the various systems previously discussedare presented in this manner for clarity, and can be implemented in anycombination and configuration. The various systems of die pricing system28 shown in FIG. 1 and chip pricing system 40 shown in FIG. 2 can beimplemented on separate computers or combined into fewer systems.Additionally, the functions provided by each system can be combined orrearranged among systems without departing from the invention. Forexample, complexity system 36 and calculation system 38 can be locatedon a separate computer (not shown) and/or combined into a single system.Alternatively, base die system 30 and custom die system 34 can becombined into a single system that designates all die parameters.

[0040]FIG. 4 depicts a chip pricing method according to one aspect ofthe invention. Initially, the base parameters are designated (a base dieis selected) in step S1. A reference die can then be created in step S2based on the base parameters. Custom parameters are designated in stepS3 to yield a custom die. Based on the custom parameters and thereference die, a complexity factor is calculated in step S4. The customdie price is then calculated in step S5 based on the base parameters,the custom parameters and the complexity factor. Various steps of themethod can be repeated, for example, a user can choose to modify one ormore of the base parameters thereby necessitating the creation of a newreference chip. Conversely, a user can modify one or more of the customparameters and view the effects that these modifications have on thecustom die price.

[0041] Package parameters can be designated in step S6. Step S7 can thencalculate a chip price based on the custom die price and designatedpackage parameters. This calculation may include first calculating apackaging price using the packaging parameters and adding/subtractingthis price to/from the custom die price. A user can select to modify thepackage parameters to obtain a new chip price. Additionally, the userremains able to modify base parameters and/or custom parameters for thecustom chip.

[0042] Step S8 allows a quantity to be designated, and the chip pricemay be adjusted in step S9 based on the quantity designated. Dependingon several factors, including manufacturing parameters, variousquantities may cause the chip price to be adjusted upward, downward orremain the same. For example, a quantity of one hundred chips may berequested which, due to the manufacturing process, inefficiently usesthe machinery and/or material. Consequently, the price of each chip maybe adjusted upward. As before, a user can modify the quantity or any ofthe other parameters to obtain a new chip price.

[0043] It is understood that the method depicted in FIG. 4 is onlyexemplary of the methods of the invention. Each step is shown in alinear fashion for clarity. Steps may be performed in parallel (forexample, steps S2 and S3), and/or the order of the steps can bemodified. Additionally, when steps are repeated, all subsequent stepsmay not be required. For example, when a user decides to modify a baseparameter (step S1), it may not be necessary for the user to designatethe custom parameters (step S3) again.

[0044] Finally, the previous discussions detail the creation of a customdie, followed by packaging, followed by quantity. It is understood thatthe these selections can be made in any order under the invention. Forexample, a user could first designate packaging parameters, then aquantity, followed by the custom die.

[0045] In the previous discussion, it is understood that the methodsteps discussed can be performed by a processor, such as CPU 16 ofcomputer 12, executing instructions of a program product (for example,die pricing system 28) stored in memory 14. It is understood that thevarious devices, modules, mechanisms and systems described herein may berealized in hardware, software, or a combination of hardware andsoftware, and may be compartmentalized other than as shown. They may beimplemented by any type of computer system or other apparatus adaptedfor carrying out the methods described herein. A typical combination ofhardware and software could be a general-purpose computer system with acomputer program that, when loaded and executed, controls the computersystem such that it carries out the methods described herein.Alternatively, a specific use computer, containing specialized hardwarefor carrying out one or more of the functional tasks of the inventioncould be utilized. The present invention can also be embedded in acomputer program product, which comprises all the features enabling theimplementation of the methods and functions described herein, and which,when loaded in a computer system, is able to carry out these methods andfunctions. Computer program, software program, program, program product,or software, in the present context mean any expression, in anylanguage, code or notation, of a set of instructions intended to cause asystem having an information processing capability to perform aparticular function either directly or after the following: (a)conversion to another language, code or notation; and/or (b)reproduction in a different material form.

[0046] The foregoing description of various aspects of the invention hasbeen presented for purposes of illustration and description. It is notintended to be exhaustive or to limit the invention to the precise formdisclosed, and obviously, many modifications and variations arepossible. Such modifications and variations that may be apparent to aperson skilled in the art are intended to be included within the scopeof the invention as defined by the accompanying claims.

What is claimed is:
 1. A computerized method of calculating a custom dieprice, comprising: providing an interface for designating baseparameters; selecting a base die based on the base parameters; creatinga reference die based on a design methodology and the base parameters;calculating a complexity factor based on designated custom parametersand the reference die; and calculating the custom die price based on thebase die, the custom parameters and the complexity factor.
 2. The methodof claim 1, wherein the base parameters include a technology, anX-dimension, a Y-dimension and a number of levels of metal.
 3. Themethod of claim 1, wherein the selecting step includes: providing a setof possible base dies based on the designated chip parameters; andselecting the base die from the set of possible base dies.
 4. The methodof claim 1, wherein the reference die is a most complex die availablebased on the designated base parameters.
 5. The method of claim 1,wherein the custom parameters include a core, an oxide level, a soldertype, a cell logic circuit count, register array parameters and memoryparameters.
 6. The method of claim 1, wherein the calculating acomplexity factor step includes: creating a custom die having the baseparameters and the custom parameters; determining a custom die yield;determining a reference die yield; and dividing the custom die yield bythe reference die yield to provide the complexity factor.
 7. The methodof claim 1, wherein the calculating the custom die price step includes:calculating a base die price for the base die; providing the custom dieprice by modifying the base die price based on the custom parameters;and adjusting the custom die price using the complexity factor.
 8. Themethod of claim 1, further comprising calculating a chip price based onthe custom die price and designated package parameters.
 9. The method ofclaim 8, further comprising: designating a chip quantity; and adjustingthe chip price based on the chip quantity.
 10. A computerized method ofcalculating a custom die price, comprising: designating base parameters;calculating a base die price based on the base parameters; creating areference die based on a design methodology and the base parameters;creating a custom die by designating custom parameters; calculating acomplexity factor based on the custom die and the reference die; andcalculating the custom die price based on the base die price, the customdie and the complexity factor.
 11. The method of claim 10, wherein thedesignating step includes: providing a set of possible base dies; andselecting a base die from the set of possible base dies.
 12. The methodof claim 11, wherein the designating step further includes selecting afirst base parameter, wherein each possible base die includes the firstbase parameter.
 13. The method of claim 10, wherein the calculating acomplexity factor step includes: determining a custom die yield based onthe custom die; determining a reference die yield based on the referencedie; and dividing the custom die yield by the reference die yield toprovide the complexity factor.
 14. The method of claim 10, wherein thecalculating the custom die price step includes: modifying the base dieprice based on the custom parameters to provide the custom die price;and adjusting the custom die price using the complexity factor.
 15. Themethod of claim 10, further comprising calculating a chip price based onthe custom die price and designated package parameters.
 16. The methodof claim 15, further comprising: designating a chip quantity; andadjusting the chip price based on the chip quantity.
 17. A system fordetermining a custom die price, comprising: a base die system fordesignating base parameters; a reference die system for creating areference die based on the base parameters and a design methodology; acustom die system for designating custom parameters; a complexity systemfor calculating a complexity factor based on the custom parameters andthe reference die; and a calculation system for calculating the customdie price based on the base parameters, the custom parameters and thecomplexity factor.
 18. The system of claim 17, further comprising apackaging system for calculating a chip price based on the custom dieprice and designated packaging parameters.
 19. The system of claim 18,further comprising a volume system for adjusting the chip price based ona designated quantity.
 20. A computer program product comprising acomputer useable medium having computer readable program code embodiedtherein for determining a custom die price, the program productcomprising: program code for designating base parameters; program codefor calculating a base die price based on the base parameters; programcode for creating a reference die based on a design methodology and thebase parameters; program code for creating a custom die by designatingcustom parameters; program code for calculating a complexity factorbased on the custom die and the reference die; and program code forcalculating a custom die price based on the base die price, the customdie and the complexity factor.
 21. The computer program product of claim20, wherein the program code for designating base parameters includes:program code for providing a set of possible base dies; and program codefor selecting a base die from the set of possible base dies.
 22. Thecomputer program product of claim 21, wherein the program code fordesignating base parameters further includes program code for selectinga first base parameter, wherein each possible base die includes thefirst base parameter.
 23. The computer program product of claim 20,wherein the program code for calculating a complexity factor includes:program code for determining a custom die yield based on the custom die;and program code for determining a reference die yield based on thereference die.
 24. The computer program product of claim 20, wherein theprogram code for calculating a custom die price includes: program codefor calculating a custom die price for the custom die using the base dieprice and the custom die; and program code for adjusting the custom dieprice using the complexity factor.
 25. The computer program product ofclaim 20, further comprising program code for calculating a chip pricebased on the custom die price and designated package parameters.
 26. Thecomputer program product of claim 20, further comprising: program codefor providing an interface for designating a chip quantity; and programcode for adjusting the chip price based on the chip quantity.